HyperLight, UMC, and Wavetek Announce Strategic Partnership for High-Volume Foundry Production of TFLN Chiplet™ Platform
HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, today announced a strategic manufacturing partnership for high-volume foundry production of HyperLight’s TFLN (thin-film lithium niobate) Chiplet™ Platform on both 6-inch and 8-inch wafers. The collaboration marks a major inflection point in the commercialization of TFLN photonics, enabling the manufacturing capacity required for AI and cloud infrastructure deployment at scale.
HyperLight Accelerates Growth With $37M Funding Led by Summit Partners
HyperLight Corporation, a leading provider of thin film lithium niobate (TFLN) photonic integrated circuits (PICs), today announced a US$37 million Series B investment led by Summit Partners. The round includes participation from existing investors Xora Innovation, a deep tech venture fund backed by Temasek, and Foothill Ventures. Peter Chung, Managing Director and CEO of Summit Partners, will join HyperLight’s Board of Directors.
